RF Measurements of Die and Packages

Book excerpt: The recent explosion of the RF wireless integrated circuits (IC), coupled with higher operating speeds in digital IC's has made accurate RF testing of IC's vital. This ground-breaking resource explains the fundamentals of performing accurate RF measurements of die and packages. It offers you practical advice on how to use coplanar probes and test fixtures in the lab for RF on-wafer die and package characterization. It also details how to build separate RF test systems for noise, high-power, and thermal testing as well as de-embed the test system's parasitic effects to get the die's RF performance. This book is a handy, practical resource for RFIC and MMIC designers as well as high-frequency digital IC designers, IC test engineers, and IC manufacturing test engineers.