Reliability of Next Generation Power Electronics Packaging Under Concurrent Vibration, Thermal and High Power Loads
Download or Read eBook Reliability of Next Generation Power Electronics Packaging Under Concurrent Vibration, Thermal and High Power Loads PDF written by and published by . This book was released on 2008 with total page 273 pages. Available in PDF, EPUB and Kindle.
Author | : |
Publisher | : |
Total Pages | : 273 |
Release | : 2008 |
ISBN-10 | : OCLC:318683330 |
ISBN-13 | : |
Rating | : 4/5 (30 Downloads) |
Book Synopsis Reliability of Next Generation Power Electronics Packaging Under Concurrent Vibration, Thermal and High Power Loads by :
Book excerpt: This final report presents a study on predicting reliability of next generation power electronics packaging, under high power loads. The study entails computational simulation modeling of power electronics packaging under high current density, high temperature gradient, high temperature and mechanical loads. Computer simulations are used for various scenarios to predict life time to failure and predictions are compared against actual experimental field data to validate the models.