Recent Advances in Adhesion Science and Technology in Honor of Dr. Kash Mittal
Author | : Wojciech (Voytek) Gutowski |
Publisher | : CRC Press |
Total Pages | : 396 |
Release | : 2013-12-31 |
ISBN-10 | : 9789004201736 |
ISBN-13 | : 9004201734 |
Rating | : 4/5 (36 Downloads) |
Book excerpt: The surface of an object is the first thing we see or touch. Nearly every article or object we encounter at home, in industry, land transportation, aerospace, or the medical field in some way uses an adhesive, a sealant, or a decorative coating. Adhesion science provides the technology and the know-how behind these applications. Recent Advances in Adhesion Science and Technology in Honor of Dr. Kash Mittal is dedicated to Dr. Mittal’s outstanding contributions to the global adhesion community and his achievements in disseminating the science of adhesion. This Festschrift volume contains selected papers from the Special Symposium on Recent Advances in Adhesion Science and Technology held in honor of Dr. Mittal to commemorate the publication of his 100th edited book. Written by world-renowned researchers, the papers have been updated for inclusion in this volume. They offer insight into recent developments and the significant ramifications to adhesion science and adhesive technology. Nineteen articles are divided into five sections: Interfaces, Wettability, and Adhesion; Surface Modification of Polymers; Adhesion Aspects of Bio-Based Materials and Bioadhesion; Adhesives and Their Testing; and Nanomaterials and Nanocomposites. Reflecting the multidisciplinary nature of adhesion science, the topics covered include metal–polymer interfaces and ways to improve adhesion, lateral force at liquid–solid interface, particle adhesion in pharmaceutical sciences, wood joints formed without use of adhesives, reinforced polymer composites using different fillers, "green" composites, medium density fiber board surfaces for powder coating, adhesion aspects in dentistry, E. coli interactions in porous media, analysis of adhesive behavior in bonded assemblies, soy proteins as wood adhesives, carbon nanotube-based interphase sensors, and reaction of multiwalled carbon nanotubes with gaseous atoms.