Modeling and Process Optimization of Solder Paste Stencil Printing for Micro-BGA and Fine Pitch Surface Mount Assembly
Download or Read eBook Modeling and Process Optimization of Solder Paste Stencil Printing for Micro-BGA and Fine Pitch Surface Mount Assembly PDF written by Jianbiao Pan and published by . This book was released on 2000 with total page 216 pages. Available in PDF, EPUB and Kindle.
Author | : Jianbiao Pan |
Publisher | : |
Total Pages | : 216 |
Release | : 2000 |
ISBN-10 | : OCLC:46955617 |
ISBN-13 | : |
Rating | : 4/5 (17 Downloads) |
Book Synopsis Modeling and Process Optimization of Solder Paste Stencil Printing for Micro-BGA and Fine Pitch Surface Mount Assembly by : Jianbiao Pan
Book excerpt: The experimental data were analyzed by Analysis of Variance (ANOVA). The critical variables were identified and interactions between process variables were determined. The experimental results are shown to be consistent with the theoretical model. This study will help to accelerate the development and utilization of BGA, CSP and flip chip packages.