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Type: BOOK - Published: 2012-02-02 - Publisher: Springer Science & Business Media
Design technology to address the new and vast problem of heterogeneous embedded systems design while remaining compatible with standard “More Moore” flows,
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Type: BOOK - Published: 2018-04-17 - Publisher: CRC Press
Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D int
Language: en
Pages: 798
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Type: BOOK - Published: 2011-09-22 - Publisher: John Wiley & Sons
The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the r