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Processing, Materials, and Integration of Damascene and 3D Interconnects
Language: en
Pages: 171

Processing, Materials, and Integration of Damascene and 3D Interconnects

Authors: J. C. Flake
Categories: Science
Type: BOOK - Published: 2010-04 - Publisher: The Electrochemical Society

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This issue focuses on recent advances in damascene interconnects and 3D interconnects.
Processing Materials of 3D Interconnects, Damascene, and Electronics Packaging 6
Language: en
Pages: 140

Processing Materials of 3D Interconnects, Damascene, and Electronics Packaging 6

Authors: K. Kondo
Categories: Science
Type: BOOK - Published: 2015-04-30 - Publisher: The Electrochemical Society

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Materials, Formulation, and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB
Language: en
Pages: 57

Materials, Formulation, and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB

Authors: W.-P. Dow
Categories: Science
Type: BOOK - Published: 2018-09-21 - Publisher: The Electrochemical Society

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Thin Film Materials, Processes, and Reliability
Language: en
Pages: 438

Thin Film Materials, Processes, and Reliability

Authors: G. S. Mathad
Categories: Technology & Engineering
Type: BOOK - Published: 2003 - Publisher: The Electrochemical Society

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High-Speed Photonics Interconnects
Language: en
Pages: 227

High-Speed Photonics Interconnects

Authors: Lukas Chrostowski
Categories: Computers
Type: BOOK - Published: 2017-12-19 - Publisher: CRC Press

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Dramatic increases in processing power have rapidly scaled on-chip aggregate bandwidths into the Tb/s range. This necessitates a corresponding increase in the a