Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still ba

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime

Electronics has become the largest industry, surpassing agriCUlture, auto. and heavy metal industries. It has become the industry of choice for a country to pro

Provides the advances in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. This book discusses packages that