Modeling and Characterization of Electromigration Failures in IC Metallization Systems and Copper Metallization for ULSI Applications
Download or Read eBook Modeling and Characterization of Electromigration Failures in IC Metallization Systems and Copper Metallization for ULSI Applications PDF written by Jiang Tao and published by . This book was released on 1995 with total page 358 pages. Available in PDF, EPUB and Kindle.
Author | : Jiang Tao |
Publisher | : |
Total Pages | : 358 |
Release | : 1995 |
ISBN-10 | : UCAL:C3389384 |
ISBN-13 | : |
Rating | : 4/5 (84 Downloads) |
Book Synopsis Modeling and Characterization of Electromigration Failures in IC Metallization Systems and Copper Metallization for ULSI Applications by : Jiang Tao
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