Measurement of Thermal-mechanical Wirebond Displacement in Electrically Active Power Semiconductors
Download or Read eBook Measurement of Thermal-mechanical Wirebond Displacement in Electrically Active Power Semiconductors PDF written by Seth M. Avery and published by . This book was released on 2009 with total page 198 pages. Available in PDF, EPUB and Kindle.
| Author | : Seth M. Avery |
| Publisher | : |
| Total Pages | : 198 |
| Release | : 2009 |
| ISBN-10 | : WISC:89106360076 |
| ISBN-13 | : |
| Rating | : 4/5 (76 Downloads) |
Book Synopsis Measurement of Thermal-mechanical Wirebond Displacement in Electrically Active Power Semiconductors by : Seth M. Avery
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