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The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the r
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Type: BOOK - Published: 2019-01-25 - Publisher: John Wiley & Sons
This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and mate
Language: en
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Pages: 376
Type: BOOK - Published: 2016-04-19 - Publisher: CRC Press
Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling
Language: en
Pages: 542
Pages: 542
Type: BOOK - Published: 2000 - Publisher: SPIE Press
This volume describes concurrent engineering developments that affect or are expected to influence future development of digital diagnostic imaging. It also cov