Design And Modeling For 3d Ics And Interposers
Download or Read eBook Design And Modeling For 3d Ics And Interposers PDF written by Madhavan Swaminathan and published by World Scientific. This book was released on 2013-11-05 with total page 379 pages. Available in PDF, EPUB and Kindle.
| Author | : Madhavan Swaminathan |
| Publisher | : World Scientific |
| Total Pages | : 379 |
| Release | : 2013-11-05 |
| ISBN-10 | : 9789814508612 |
| ISBN-13 | : 9814508616 |
| Rating | : 4/5 (12 Downloads) |
Book Synopsis Design And Modeling For 3d Ics And Interposers by : Madhavan Swaminathan
Book excerpt: 3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution.
